The rapid development of computer technology, modern communication technology, optoelectronic technology and space technology has put forward new requirements for relay technology. The development of new technology and new technology undoubtedly plays a role in promoting the development of relay technology.

The rapid development of microelectronic technology and super-large scale IC also puts forward new requirements for relays. The first is to miniaturize and flake. For example, the military TO-5(8.5×8.5×7.0mm) relay encapsulated by IC has high vibration resistance, which can make the equipment more reliable; The second is the combination and multi-function, can be compatible with IC, can be built in amplifier, the sensitivity to improve to microwatt level; The third is total solids. Solid state relay has high sensitivity and can prevent electromagnetic interference and RF interference.

The popularization of computer technology makes the demand of microcomputer relay increase significantly, the relay with microprocessor will develop rapidly. At the beginning of 1980s, the digital time relay produced in the United States can be controlled by instructions to the relay. The combined development of relay and microprocessor can form a small and perfect control system. Computer-controlled industrial robots are growing at a rate of 3.5 percent a year. Computer-controlled production systems can now produce a wide range of low-cost relays on a single production line, and perform a wide range of operations and tests automatically.

The development of communication technology has far-reaching significance for the development of relay. On the one hand, due to the rapid development of communication technology, the application of the whole relay has increased. On the other hand, because the optical fiber will be the future information society transmission aorta, in the optical fiber communication, optical sensing, optical computer, optical information processing technology under the promotion of the emergence of optical fiber relay, reed fiber switch and other new relays.

Optoelectronic technology will play a great role in promoting relay technology. In order to realize the reliable operation of optical computer, a bistable relay has been trial-produced.

In order to improve the reliability of aviation and aerospace relays, the expected failure rate of relay should be reduced from the current 0.1ppm to 0.01ppm; The manned space station requires 0.001PPM. The temperature resistance should be above 200℃, the vibration resistance should be higher than 490m/s, and it should be able to withstand 2.32×10(4)C/Kg alpha ray radiation. To meet the space requirements, reliability studies must be strengthened and specialized high-reliability production lines must be established.

New material with special structure, new materials, high performance composite materials, optoelectronic materials, oxygen and magnetic material, the development of thermal magnetic materials, amorphous soft magnetic materials to develop new magnetic hold relay, temperature relays, electromagnetic relay all has the vital significance, and will appear new principle, the effect of the relay.

With the improvement of miniaturization and chip technology. Relays will be two - and three - dimensional size only a few millimeters of miniature and surface mount direction; Now the volume of relays produced by some manufacturers in the world is only 1/4 ~ 1/8 of that of 5 ~ 10 years ago. Because the electronic machine in the reduction of volume, the need for the height of other electronic components do not exceed the smaller relay. The BA series of ultra-dense signal relays produced by Fujitsutakamisawa are only 14.9(W)×7.4(D)×9.7(H)mm and are used in fax machines and modems. They can withstand up to 3kV of voltage fluctuations. The AS series of surface-mounted relays are only 14(W) x 9(D) x 6.5(H)mm in size.

In the field of power relays, safe and reliable relays are especially needed, such as high insulation relays. The JV series power relays from Fujitsutakamisawa contain five amplifiers and are designed with a high insulation and small cross section, with a size of 17.5(W)×10(D)×12.5(H)mm. Due to the use of reinforced insulation system between the movement and the outer edge, its insulation performance reaches 5kV. NEC's MR82 series power relay has a power consumption of 200mW.

Various amplifying, delay, contact jitter elimination, arc extinguishing, remote control, combined logic circuits can be installed inside the relay to make it have more functions. With breakthroughs in SOP technology, it is possible for manufacturers to integrate more and more functions. The combination of relay and microprocessor will have a wider range of specialized control functions, so as to achieve high intelligence.

The rise of new technology in groups will promote the development of all kinds of relays with different principles, performances, structures and uses. Drived by scientific and technological progress, demand traction and development of sensitive and functional materials, the performance of special relays, such as temperature, radio frequency, high voltage, high insulation, low thermal potential and non-electric control relays will be improved day by day.

Electromagnetic relay (EMR) has a history of more than 150 years since the first use of telephone relays. With the development of electronic industry, especially the breakthrough of optical coupling technology in the early 1970s, solid-state relay (SSR, also known as electronic relay) suddenly emerged. Compared with the traditional relay, it has the advantages of long life, simple structure, light weight, reliable performance and so on. Solid-state relays have no mechanical switches and have important characteristics such as high microprocessor compatibility, high speed, shock resistance, vibration resistance, low leakage and so on. Also, because the product has no mechanical contact, it does not generate electromagnetic noise, so there is no need to add components such as resistors and capacitors to keep it quiet. Conventional relays require these additional components, so they tend to be heavy, complex, and expensive.

In the future, the market development of small sealed relays will focus on IC-compatible TO-5 relays and 1/2 crystal cover relays. Military relays will accelerate their transition to industrial/commercial use. US military relays account for about 20% of the total relays. The market for general purpose relays continues to evolve towards small, thin and plastic seals. Small PCB relays will continue to be the mainstream of the development of the general relay market. The solid state relays will become more widespread, the price will continue to decline, and the relays will be more reliable, small size, high inrush current shock resistance and interference resistance. The market for tongue reed relays will continue to expand. The applications and demand of surface mounted relays will be on the rise

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